Bitspower CPU Block Summit M Pro with OLED and Thermal Grizzly Intel 13th/14th Gen CPU Contact Frame Bundle, 12th Gen Intel LGA 1700

This bundle includes the Summit M Pro OLED CPU Water Block and Thermal Grizzly INTEL LGA 1700 contact frame.

Bitspower Summit M Pro OLED is an efficient solution for Intel and AMD CPU water cooling. It equipped with a digital thermal sensor and a OLED display . Including brackets and accessories for Intel and AMD platforms, this CPU block is all you’ll need to keep your processor from overheating.

In order to make heat exchange as efficient as possible, The copper base plate can effectively dissipate heat. Then, the Bitspower water injection design also brings a high flow of coolant, making cooling as efficient as possible.

The Summit M Pro OLED, equipped with Bitspower Digital RGB around the top plate, is sure to become the center of attention of your case with bright LEDs that are certified by ASUS AURA Sync, GIGABYTE RGB Fusion2.0, MSI Mystic Light Sync, and ASRock Polychrome.

Thread : G1/4" x 2

LED Color : Digital RGB
LED Strip Management By Bitspower Digital RGB And Certified By ASUS AURA Sync, GIGABYTE RGB Fusion, MSI Mystic Light Sync, ASRock Polychrome and Razer Chroma.

Digit thermal sensor

Input Voltage : DC 5V~12V
Temperature : 0~99°C(32~210.2°F)
operate current : <20ma

Dimension(LxWxH) : 95x95x26 MM

The Intel 13th and 14th Gen CPU Contact Frame is a mounting aid that replaces the motherboard's original Integrated Loading Mechanism (ILM) to enable better cooling performance of CPU coolers through optimized contact pressure.

Due to the changed dimensions of the Intel Raptor Lake (Intel Core 13th and 14th Gen) for the Intel Socket LGA1700 compared to the Socket 1200 processors (and older generations, such as Socket LGA115X) as well as the associated changes to the dimensions of the socket, New mounting brackets for CPU coolers have become necessary.

Additionally, the standard ILM only has contact points in the middle of the elongated CPU. Due to the resulting uneven contact pressure of the processor into the socket, the surface of the Integrated Heatspreader (IHS) bulges concavely, which means that the base plate of the CPU cooler rests primarily on the edges of the IHS and thus the thermal "hotspot" in the middle of the CPU is not covered.

Included :
2Set of G1/4" True Brass Enhance Multi-Link For OD 12MM 1Pcs of AM4 Bracket
1set of CPU Block Summit MS Mounting Kit for LGA 17001Set of CPU backplate
1Set of CPU backplate (AMD4)
1 Set of BPA-TP1 thermal compound (2.5G)
1Set of Mounting Screws/Accessories
1Thermal Grizzly LGA 1700 Contact Frame