The thermal pad is silicone-based with modeling clay-like consistency. This allows a perfect surface shaping with maximum possible compression. The minus pad extreme is electrically insulating.
Due to the consistency, only one-time use is recommended. The thermal conductivity was improved by about 260 % over the minus pad 8 which allows the best cooling for tough cooling operations such as voltage regulators and memory ICs.
- Most excellent thermal conductivity
- No bleeding
- long-term stability
- high compression rate