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Optimus Signature V3 CPU Block (AMD) and Thermal Grizzly Ryzen 7000 Direct Die Frame Bundle, Nickel Ceramic - Nickel

Product Highlights
  • This bundle includes the?Optimus Signature V3 block and the Thermal Grizzly?AMD Ryzen 7000?Direct Die Frame
  • The Optimus Signature V3 block is the finest CPU block ever created for AMD AM5 CPUs
  • The Optimus Signature V3 AMD is measurably cooler than competing blocks, in bothbare die and standard IHS applications
  • CPU mounting frame for mounting Ryzen 7000 processors without the integrated heat spreader
  • Allows for significantly lower temperatures during operation
Sale Price $288.10 Regular Price $293.98
Out of stock
Overview

This bundle includes the Optimus Signature V3 block and the Thermal Grizzly AMD Ryzen 7000 Direct Die Frame.

The Optimus Signature V3 block is the finest CPU block ever created for AMD AM5 CPUs. With the goal of creating the best ever, we went back to the drawing board and redesigned a CPU block from the ground up. 100% new cold plate, revolutionary Jet Structure and a monolithic metal body worthy of the Signature name.

WORLD-CLASSPERFORMANCE
The Optimus Signature V3 AMD is measurably cooler than competing blocks, in bothbare die and standard IHS applications. With 3-6c better performance than other blocks on standard installations and an incredible 6.71c better performance than the Thermal Grizzly Mycro block on direct die, The Signature V3 is made for the highest performance available.

Benchmarked using a labratory-grade testing system with a margin of error of only +/-0.3c, the Signature V3 is able to handle even the most demanding Ryzen 7000 performance loads in 24/7 applications.

WHY SO GOOD?
The biggest reason Optimus blocks are so much better than the competition is because the high heat output in increasingly smaller areas. For example, a GPU die used to output 250w maximum. Now, GPUs have smaller dies but vastly higher heat output at 600w.

With the latest CPUs, especially bare die, the actual surface area needing to be cooled is extremely compact. This means the fins directly above the die itself do the majority of the work to cool the CPU.

Performance is relatively simple to explain: surface area + flow rate + contact = performance. By having the highest possible surface area directly above the dies, and then increasing the flow rate through the new Signature jet system, plus a highly-specific contact mounting system for AM5, the Optimus Signature V3 is able to remove heat at a faster rate than competing designs.

BARE DIE OPTIMIZED
The Signature Block is ready for bare die or standard installations out of the box. Included 4mm spacers compensate for the removal of the CPU IHS.

We went through numerous block designs, including extremely custom bare-die specific models, to arrive at a block that has top performance for both lidded and delidded applications.

Note: die frame from a 3rd party is required for bare die installation.

IMPORTANT: Bare die and delidding CPUs void CPU warranties and are only for expert PC builders who want to push the extremes of what a CPU can achieve. We recommend using the Optimus V3 on a standard IHS (no delidding).

Revolutionary Jet Structure
The new two piece jet structure (blue) replaces typical jet plates and inserts, allowing for maximum flow with highest possible velocity onto the fins. The unique flow path transitions from a circle to a slot with zero bends or edges that create liquid vortexes that slow the velocity of the coolant. Because of its unique, non-traditional shape, the insert is impossible to be machined out of a single piece of material, requiring a two piece design machined with extreme precision so the two pieces mate together perfectly. When machined out of Delrin polymer, the insert strength, surface finish, and precision surpasses anything that could be done with injection molding or 3D printing.

GROUND UP DESIGN
The Signature Block was fully designed with AM5 CPUs in mind. The offset jet structure design targets the CPU chiplets directly, while keeping the massive copper cold plate itself centered over the entire IHS. The V3 went through numerous iterations and tests to dial in the correct offset, cold plate size, bow shape and flow path, resulting in a block that squeezes out every last bit of performance from the CPU.

NEXT-LEVEL CONSTRUCTION
Many new developments went into the Signature V3 block:

Monolithic solid top machined from 3.5lb block of brass for extreme rigidity and precision
New sloped and contoured block design
Delrin polymer two-piece jet block insert mated into single solid piece
Jet Structure designed to match AM5 IHS heat spreader bow shape
New Signature Gen3 copper cold plate with 25% larger fin area
Streamlined mounting nuts for exact torque installation
New custom stainless mini screwdriver

Signature GEN3 MICROFIN COLD PLATE

THE BEST IS NOW BETTER
Optimus's legendary fin design features the finest fins in the world, now improved with a 25% larger cold plate designed for Optimus Signature blocks (Gen3 vs Gen2 cold plate shown).

Additionally, numerous other improvements have gone into the Gen3 cold plates beyond simply fin area. Now fins are even more precise and stronger for incredibly even flow across the entire surface. Additional work has gone into the overall design, including wall thickness, exit pockets and IHS matching characteristics.

While making an Optimus cold plate takes considerably longer than a traditional cold plate, the performance results are worth it.

SURFACE AREA MATTERS
Cooling is simple: more surface area = better cooling. Larger radiators perform better than small radiators. Same with cold plates, more surface area is able to dissipate heat at a faster rate than lower surface area cold plates. While large fin cooling designs were acceptable for lower wattage products, these days they are easily overwhelmed by modern higher power components. This is especially critical with new, smaller dies with far greater wattages. The smaller and more powerful it becomes, the more difficult it is to cool.

THE FINEST FINS EVER CREATED
Over three years of development went into creating our truly next-level patent-pending fin technology. Using a fully CNC machining process, Optimus is able to achieve 0.1016mm (0.004”) fins with 0.2032mm (0.008”) micro channels. This isn't just superior craftsmanship, it's generations beyond other fin designs.

WORLD'S SMOOTHEST COLDPLATE
Optimus sets another record for flattest cold plate on the market. Optimus machines blocks less than 1 micro-inch (µin) in flatness. This is 0.000025mm of roughness (measuring the peaks and valleys of the surface).Other companies are over 400% rougher than Optimus coldplates.

The only way to truly guarantee 0.000025mm level of accuracy is to CNC the cold plate perfectly with diamond bits. Optimus created proprietary diamond tooling that allows the cold plates to come off the CNC with a perfect mirror finish.

Additionally, because we control the fins and cold plate to such a precise level, we can make the distance between CPU IHS and the fins extremely small. Thin cold plates are able to transfer heat from the CPU faster than thicker cold plates.

MATERIALS
TOP PLATE: US-sourced brass monoblock
COLD PLATE: US-sourced premium C110-grade copper
COLD PLATE FINISH: Raw copper or electroless Pro-XE nickel
THUMB NUTS: US-sourced machined 6061 aluminum, satin hard anodized
O-RINGS: US-made plasticizer-free EPDM o-rings
MOUNTING POSTS: US-made 18-8 stainless steel stainless steel cold plate screws

COMPATABILITY
MOUNTING: AMD AM5 and AM4 sockets. Not compatible with Threadripper TR4, Epyc or AM3
CPUs: Compatible with Ryzen 7000+, 5000 and 3000 CPUs

The AMD Ryzen 7000 Direct Die Frame is a CPU mounting frame for mounting Ryzen 7000 processors without the integrated heat spreader. By omitting the heat spreader, the CPU cooler can be mounted directly on the processor's chiplets, allowing for significantly lower temperatures during operation. This is not only interesting for extreme overclockers on the hunt for records, but also for gamers and content creators.

For gaming PCs and desktop workstations, cooling the processor is important so that they are not slowed down during rendering operations, for example, or enable the highest possible FPS when gaming. Silent PCs for multimedia applications also benefit from better heat dissipation from the processor. In addition to a good cooling solution, PC enthusiasts use "delidding" CPUs to optimise heat dissipation.

When delidding a CPU, the heat spreader of the processor is removed. Often this is done to replace the thermal conductive materials used by the manufacturer with higher quality thermal pastes or liquid metal such as Thermal Grizzly's Conductonaut before the heat spreader is remounted. With the so-called "direct die", the heat spreader is completely omitted so that the base plate of the CPU cooler has direct contact with the CPU.

When the CPU cooler is mounted directly on the CPU chips, the heat that is generated during operation of the CPU is dissipated directly to the cooler and does not first have to be transferred through the heat spreader. This makes heat dissipation more efficient and the CPU is cooled better. The purpose of the AMD Ryzen 7000 Direct Die Frame is to protect the exposed chiplets of the Ryzen 7000 CPU. Without a direct die frame, the CPU's function can be impaired by the contact pressure of the CPU cooler. Here, problems with the RAM in particular are very common and, in the worst case, the CPU can become unusable.

  • Compatible with AMD Ryzen 7000
  • Allows mounting of delidded Ryzen CPUs
  • Easy mounting
  • Anodised aluminium


Dimensions: 70 mm x 53 mm x 4 mm
Material: Anodised aluminium
Color black

Details
More Information
Titan Rig SKU03-20-OP-0107-05-CN
Shop BundlesYes
ModelTR-18704-99069
Free Ground Shipping Eligible On Orders Over $99 With Code: FREESHIPPINGYes
Promo Express Shipping EligibleYes
BrandOptimus
LightingNone
AMD CPU SocketSocket AM5
Product SeriesSignature
Enterprise ReadyNo

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